maf00021eem mn103s73 series type mn103SF73N mn103sf73r internal rom type flash rom (byte) 512k 1024k ram (byte) 32k package (lead-free) qfp100-p-1818b minimum instruction execution time 25 ns (at 2.7 v to 3.6 v, 40 mhz) ? interrupts reset. irq 8 . nmi. timer 28. i 2 c 3. sif 10 . dma 12 . wdt. a/d. time base timer 2 . system error. remote control 4 ? timer counter 8-bit timer 10 reload-down count. cascade connection possible (usable as a 16-bit to 32-bit timer) 16-bit timer 6 up-down count. input capture. pwm output. compare/capture register 2 channnels time base timer 1 watchdog timer 1 ? serial interface uart/synchronous/multi-master i 2 c interface selective 3 uart/synchronous interface selective 2 ? remote contorol interface remote control reception: correspondence with aeha (association for electric home appliances) format. queued reception by low speed clock ? dma controller number of channels: 4 channels unit of transfer: 8/16/32 bits maximum transfer cycles: 65535 starting factor: external interrupt. timer. serial transmission/reception. a/d conversion ?nish. i 2 c transmission/reception. software. remote control data reception transfer method: 2-bus cycle transfer adressing modes: fixed. increment. decrement transfer mode: word transfer. burst transfer. intermittent transfer ? i/o pins i/o 22 : (5 v i/o) common use 59 : (3 v i/o) common use input 1 : (3 v i/o) common use ? a/d converter 10-bit 8 channels. 5 v input ? rom correction 8 channels ? electrical charactreistics (a/d converter characteristics) parameter symbol condition limit unit min typ max resolution 10 bits non-linear error vdd5 = vrefh = 3.3 v. vss = 0 v vdd5 = vrefh = 5.0 v. vss = 0 v 4 lsb differential non-linearity error 4 lsb
maf00021eem mn103SF73N, mn103sf73r ? pin assignment qfp100-p-1818b p00, sbo0a, nwe0, nsdqm 0 p01, sbi0a, nwe1, nsdqm1 p02, sbt0a, nr e p03, sbo2a, sda2a, nswe p04, sbi2a, scke p05, sbt2a, scl2a, nscas p06, irq5b, nsra s p10, tm4io, ocd_sd a p1 1, tm5io, ocd_scl p12, tm6io, sysclk mmod osco osci vs s xi, p0 7 xo vdd3 3 vdd18, vout nrst lo n p14, sbt1b, tm14ioa p15, sbo1b, tm14iob p16, sbi1b, tm7io ocdmod p20, irq0a, dk(vpp ) p63, a2 p62, a3 p61, a4 p60, a5 p57, a6 p56, a7 p55, a8 p54, a9 p53, a1 0 p52, a1 1 p51, a1 2 vs s p50, a1 3 vdd1 8 p35, sbt3a, scl3a, a1 4 p34, sbi3a, a1 5 p33, sbo3a, sda3a, a1 6 p32, sbt1a, a1 7 p31, sbi1a, a1 8 p30, sbo1a, a1 9 p25, irq5a, a2 0 p24, irq4a, ncs3 p23, irq3a, ncs2 p22, irq2a, ncs1 p21, irq1a, rmin, ncs0 vdd18 p42, sbt4, scl4, irq7, nmirq p41, sbo4, sda4, irq 6 p40, sbi4, tm13iob, d1 5 p87, tm13ioa, d1 4 p86, tm12iob, d1 3 p85, tm12ioa, d1 2 p84, tm1 1iob, d1 1 p83, tm1 1ioa, d1 0 p82, tm10iob, d9 p81, tm10ioa, d8 p80, sdclki vss p77, sdclko vdd33 p75, d7 p74, d6 p73, d5 p72, d4 p71, d3 p70, d2 p67, d1 p66, d0 p65, a0 p64, a1 p90, sbo0b p91, sbi0b p92, sbt0b p93, sbo3b, sda3b p94, sbi3b p95, sbt3b, scl3b pd0, sbo2b, sda2b pd1, sbi2b pd2, sbt2b, scl2b pd3, irq0b pd4, irq1b pd5, irq2b pd6, irq3b, tm15ioa vdd 5 pd7, irq4b, tm15iob vss pa 0, an 0 pa 1, an 1 pa 2, an 2 pa 3, an 3 pa 4, an 4 pa 5, an 5 pa 6, an 6 pa 7, an 7 vrefh 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 note) vdd 5 = vdd33 to 5.5 v. vdd33 = 2.7 v to 3.6 v
request for your special attention and precautions in using the technical information and semiconductors described in this book (1) if any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) the technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. no license is granted in and to any intellectual property right or other right owned by panasonic corporation or any other company. therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) the products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod- ucts may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. (4) the products and product specifications described in this book are subject to change without notice for modification and/or im- provement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (5) when designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (esd, eos, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. when using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) this book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20080805
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